1. -- Best performance¸ supports up to TDP 130W. 2.Heatsink -- 6 heatpipes¸ maximized heat transfer. High density of aluminum fins¸ provides large surface for heat dissipation. Seamless soldering process and large copper base provide good contact for heat conductivity. 3. 3 in 1 application--For LGA775 push pin design for faster install.For K8 and latest socket AM2¸ tool-less clip¸ easy to install. 4. VR Fan -- Silent and powerful VR fan¸ 16dBA at minimum fan speed. Adjustable fan control to boost cooling performance.""
Product Type: CPU Cooler
|
|
|
